Semiconductor module comprising semiconductor chips and method for producing the same
US7592689B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 12, 2007 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Feb 4, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes: a plastic housing composition; at least one semiconductor chip with an active top side, a coplanar underside of the semiconductor module including the active top side of the semiconductor chip(s) and a surface of the plastic housing composition; a wiring structure arranged on the coplanar underside, the wiring structure including a center region and edge regions, with external contact areas distributed uniformly in the center region; external contacts arranged on the external contact areas of the wiring structure; and at least one surface-mountable semiconductor component arranged on the wiring structure in at least one of the edge regions, the surface-mountable semiconductor component(s) having a structural height that is less than the height of the external contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.