Power module having at least two substrates
US7592696B2 · kind B2 · utility
2Cited by
5References
22Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 11, 2006 |
| Grant date | Sep 22, 2009 |
| Priority date | — |
| Expiry date | Sep 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/148
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a power module 3 and a method for producing it. The power module 3 has a first substrate 1 having power semiconductor chips 4, and a second substrate 2 populated with signal semiconductor chips 5. The substrates 1 and 2 are oriented parallel one above the other, their placement sides 7 and 8 being arranged facing one another, and the second substrate 2, with the aid of bonding wires 9 bent in hingelike fashion, being held at a defined distance d from the first substrate 1 and being mechanically fixed in a plastic housing 18 and electrically connected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.