Flex-based circuit module
US7595550B2 · kind B2 · utility
29Cited by
453References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2005 |
| Grant date | Sep 29, 2009 |
| Priority date | — |
| Expiry date | May 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design that is disposed about the form. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.