Apparatus and method for producing a bonding connection
US7597235B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 15, 2007 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Feb 1, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding operation.One aspect relates to a method for producing a bonding connection by means of a bonding apparatus having a heel shaper and a bonding stamp. The heel shaper is situated relative to the bonding stamp in a first active position or can be moved into such a first active position. In the first active position, the heel shaper ensures that the bonding wire runs in a permissible region in the heel region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.