Dirk Siepe
9Patents
2h-index
9Co-inventors
36Inventor score
Filing activity: Mar 20, 2006 → Sep 7, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8164176B2 | Semiconductor module arrangement | Electricity | 7 | Active |
| US7851913B2 | Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart | Electricity | 3 | Active |
| US9196562B2 | Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate | Electricity | 1 | Active |
| US7597235B2 | Apparatus and method for producing a bonding connection | Electricity | 1 | Active |
| US8198721B2 | Semiconductor module | Electricity | 0 | Active |
| US7654434B2 | Method, device and system for bonding a semiconductor element | Electricity | 0 | Active |
| US9129934B2 | Power semiconductor module and method for operating a power semiconductor module | Electricity | 0 | Active |
| US8955219B2 | Method for fabricating a bond | Emerging Cross-Sectional Technologies | 0 | Active |
| US8541892B2 | Bonding connection between a bonding wire and a power semiconductor chip | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.