Manufacturing method of semiconductor integrated circuit device
US7598100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2004 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Nov 18, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and secure contact between probes 7 and test pads cannot be realized. For its prevention, the thin film sheet 2 and a bonding ring 6 are bonded in a state where a tensile force is applied only to the central region IA of the thin film sheet 2, and a tensile force is not applied to an outer peripheral region OA. Then, the height of the bonding ring 6 defining the height up to the probe surface of the thin film sheet 2 is increased, thereby increasing the height up to the probe surface of the thin film sheet 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.