Semiconductor package system with substrate having different bondable heights at lead finger tips
US7598599B2 · kind B2 · utility
5Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2006 |
| Grant date | Oct 6, 2009 |
| Priority date | — |
| Expiry date | Mar 28, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.