Substrate treatment method and substrate treatment apparatus
US7600522B2 · kind B2 · utility
2Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2009 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Mar 4, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treatment method including the steps of: generating droplets of a treatment liquid by mixing the treatment liquid with a gas; and causing the treatment liquid droplets generated in the liquid droplet generating step to impinge on a surface of a substrate being treated. The treatment liquid droplets have a volume median diameter of 5 μm to 40 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.