Process and equipment for bonding by molecular adhesion
US7601271B2 · kind B2 · utility
7Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2006 |
| Grant date | Oct 13, 2009 |
| Priority date | — |
| Expiry date | Feb 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention relates to a process for bonding by molecular adhesion of two substrates to one another during which the surfaces of the substrates are placed in close contact and bonding occurs by propagation of a bonding front between the substrates. The invention includes, prior to bonding, a step of modifying the surface state of one or both of the surfaces of the substrates so as to regulate the propagation speed of the bonding front. The surface can be modified by locally or uniformly heating or roughening the surface(s) of the substrate(s).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.