Universal substrate for a semiconductor device having selectively activated fuses
US7605462B2 · kind B2 · utility
1Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2007 |
| Grant date | Oct 20, 2009 |
| Priority date | — |
| Expiry date | Apr 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/175
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A universal substrate includes a plurality of inner pads and a plurality of outer pads. A plurality of bifurcate wirings and a plurality of fuses are formed on a surface of the substrate. The fuses are connected with the bifurcate wirings in series. By the bifurcate wirings and the fuses, each of the inner pads is electrically connected to all of the outer pads to provide optional electrical disconnections therebetween. Accordingly, the universal substrate can provide for various chips with different serial arrangements of bonding pads without replacing or manufacturing another kind of substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.