Chi-Chung Yu
4Patents
1h-index
11Co-inventors
41Inventor score
Filing activity: Feb 23, 2007 → Mar 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9627228B1 | Method for manufacturing a chip package having a coating layer | Electricity | 7 | Active |
| US11158659B2 | Semiconductor device structure with anti-acid layer and method for forming the same | Electricity | 1 | Active |
| US7605462B2 | Universal substrate for a semiconductor device having selectively activated fuses | Electricity | 1 | Active |
| US12423964B2 | Intelligent system for determining hemp by headspace chemical analysis | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.