Semiconductor die attachment for high vacuum tubes
US7607560B2 · kind B2 · utility
3Cited by
19References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 28, 2005 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Aug 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Bonding and interconnect techniques including a spacer for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the tube resulting therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.