Patent · US Active

Non-pull back pad package with an additional solder standoff

US7608484B2 · kind B2 · utility

38Cited by

9References

13Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Bernhard Lange · Gerolzhofen, DE
Anthony L. Coyle · Allen, US
Jeffrey Gail Holloway · Plano, US

Key dates

Filing date	Oct 31, 2006
Grant date	Oct 27, 2009
Priority date	—
Expiry date	Nov 16, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a plurality of die on a lead frame strip. The lead frame strip comprises a plurality of package sites, which further comprises a plurality of lead pads and a die pad. The method also includes forming a channel between the lead pads of nearby package sites without singulating the packages. Another step in the method includes disposing solder on the lead pads, the die pad, or the lead pads and the die pads without substantially covering the channel with solder. The manufacturing method further includes singulating the packages.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.