Semiconductor die attachment for high vacuum tubes
US7608533B2 · kind B2 · utility
1Cited by
19References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2006 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Aug 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15312
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is described-novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.