Integrated circuit package with electrically isolated leads
US7608914B1 · kind B1 · utility
1Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2006 |
| Grant date | Oct 27, 2009 |
| Priority date | — |
| Expiry date | Jan 26, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an integrated circuit package includes a lead frame with a die paddle and several leads. Portions of the lead frame not having an external electrical connection may be thinned such that they may be encapsulated by an electrically insulating packaging material on the back of the lead frame. Portions of the lead frame having external electrical connections may have a thickness such that they are exposed through the packaging material. The lead frame may be covered by an electrically insulating cover to protect components on the lead frame from erroneous electrical contact or electrostatic discharge (ESD) damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.