Photoresist coating composition and method for forming fine pattern using the same
US7615338B2 · kind B2 · utility
1Cited by
8References
21Claims
0Family size
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Key dates
| Filing date | Dec 8, 2005 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Oct 11, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist coating composition that includes a compound represented by Formula 1 and an aqueous solvent, and a method for forming a fine pattern by coating the composition on a photoresist pattern to effectively reduce a size of a photoresist contact hole and a space, which can be applied to all semiconductor processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.