Flex circuit constructions for high capacity circuit module systems and methods
US7616452B2 · kind B2 · utility
25Cited by
304References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2006 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Aug 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided circuit modules employ flexible circuitry populated with integrated circuitry (ICs). The flex circuitry is disposed about a rigid substrate. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. A strain relief portion of the flex circuitry has preferably fewer layers than the portion of the flex circuitry along which the integrated circuitry is disposed and may further may exhibit more flexibility than the portion of the flex circuit populated with integrated circuitry. The substrate form is preferably devised from thermally conductive materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.