Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
US7619304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2006 |
| Grant date | Nov 17, 2009 |
| Priority date | — |
| Expiry date | Mar 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A panel and a semiconductor component including a composite board with semiconductor chips and plastic package molding compound and a method for the production thereof is disclosed. In one embodiment, the panel includes a composite board with semiconductor chips arranged in rows and columns in a corresponding plastic package molding compound with a plurality of semiconductor component positions. The thickness of the plastic package molding compound corresponds to the thickness of the semiconductor chips so that a coplanar upper side and a coplanar rear side are formed on the composite board. Located on the coplanar rear side of the composite board is a plastic layer whose coefficient of thermal expansion corresponds to the coefficient of thermal expansion of the composite board. Located on the coplanar upper side of the composite board is a wiring structure which has corresponding external contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.