Integrated connection arrangements

US7619309B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Stefan Drexl · Mering, DE
• Thomas Goebel · Wolfsberg, AT
• Johann Helneder · Landsham, DE
• Martina Hommel · Munich, DE
• Wolfgang Klein · Zorneding, DE
• Heinrich Körner · Bogen, DE
• Andrea Mitchell · Munich, DE
• Markus Schwerd · Holzkirchen, DE
• Martin Seck · Birkenfeld, DE

Key dates

• Filing date: Feb 9, 2006
• Grant date: Nov 17, 2009
• Expiry date: Mar 28, 2026

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30105
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A connection arrangement having an outer conductive structure arranged at least partly or completely in a cutout of an electrical insulation layer is provided. An inner conductive structure is arranged at the bottom of the cutout on one side of the insulation layer. The inner conductive structure adjoins the outer conductive structure in a contact zone. A contact area is arranged at the outer conductive structure on the other side of the cutout. The contact zone and the contact area do not overlap. The bottom of the cutout is arranged to overlaps at least half of the contact area, to provide a step in the insulation layer at the edge of the cutout outside a main current path between the contact area and the inner conductive structure.