Processing apparatus and gas discharge suppressing member
US7622017B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2004 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Dec 8, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processing apparatus for performing a process on a surface of an object to be processed by applying a high frequency power to an electrode installed in an airtight processing chamber to convert a processing gas introduced therein into a plasma, includes a thermal transfer gas feed pathway for supplying a thermal transfer gas for controlling a temperature of the object to be processed to a minute space between the object to be processed and a holding unit installed on the electrode for attracting and holding the object to be processed through an inner portion of an insulating member disposed under the electrode. A portion of the thermal transfer gas feed pathway, which passes through the inner portion of the insulating member, is formed in a zigzag shape or a spiral shape with respect to a normal direction of a holding surface of the holding unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.