Methods for chemical mechanical planarization and for detecting endpoint of a CMP operation
US7622052B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Nov 10, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods are provided for chemical mechanical planarization of a layer and for determining the endpoint of a CMP operation. In accordance with one embodiment the method for determining an endpoint comprises making a plurality of eddy current thickness measurement of the layer being planarized, each of the plurality of measurements spaced apart by a predetermined length of time. A difference is calculated between sequential ones of the plurality of eddy current measurements, and a predetermined minimum threshold for the difference is set. The endpoint is defined as a calculated difference less than the predetermined minimum threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.