Multi-step system and method for curing a dielectric film
US7622378B2 · kind B2 · utility
456Cited by
13References
24Claims
0Family size
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Key dates
| Filing date | Nov 9, 2005 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Aug 24, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.