Semiconductor device, interposer chip and manufacturing method of semiconductor device
US7622799B2 · kind B2 · utility
8Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2006 |
| Grant date | Nov 24, 2009 |
| Priority date | — |
| Expiry date | Aug 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device in which memory chips are stacked on the surface of a wiring substrate has a microcomputer chip and an interposer chip arranged on the surface of the memory chip. The pads of the microcomputer chip and the pads of the interposer chip are arranged almost circularly and are connected by bonding wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.