MEMS device and assembly method
US7628875B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2006 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Jun 26, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249953
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of bonding a MEMS device to a substrate to form a MEMS device assembly. A thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate is determined. An adhesive is deposited onto a mating surface of the MEMS device and/or the mating surface of the substrate. The mating surfaces of the MEMS device and substrate are brought together, such that the adhesive can bond the MEMS device to the substrate. The volume of adhesive deposited at particular locations on the mating surface is varied to compensate for local variations in the thickness profile of the MEMS device and/or the flatness of the mating surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.