Method of improving electrical connections in circuitized substrates
US7629559B2 · kind B2 · utility
3Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2005 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Nov 18, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/105
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of improving conductive paste connections in a circuitized substrate in which at least one and preferably a series of high voltage pulses are applied across the paste and at least one and preferably a series of high current pulses are applied, both series of pulses applied separately. The result is an increase in the number of conductive paths through the paste connections from those present prior to the pulse applications and a corresponding resistance reduction in said connections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.