Shielded package having shield fence
US7629674B1 · kind B1 · utility
98Cited by
14References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 17, 2004 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Nov 6, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A shielded package includes a shield assembly having a shield fence, a shield lid, and a shield lid adhesive electrically coupling the shield lid to the shield fence. The shield fence includes a porous sidewall through which molding compound passes during molding of the shielded package. Further, the shield fence includes a central aperture through which an electronic component is die attached and wire bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.