Wafer edge-defect detection and capacitive probe therefor
US7629798B2 · kind B2 · utility
5Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2007 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Mar 13, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer edge-defect detection system with a probe assembly having one or more capacitive plates conforming in edge shape to an edge shape of a wafer; and processing electronics for electronically driving the one or more capacitive plates and for sensing an electrical signal representing capacitance between each one or more plates and the wafer. Filtering and demodulation techniques enhance the signal to noise ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.