Automated wafer defect inspection system using backside illumination
US7629993B2 · kind B2 · utility
2Cited by
11References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Dec 8, 2009 |
| Priority date | — |
| Expiry date | Oct 7, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9505
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A defect inspection system for the semiconductor and microelectronics industry. More particularly, the present invention relates to an automated defect inspection system for wafers or other semiconductor or electronic substrates of any kind or type that are transparent, translucent, opaque or otherwise capable of allowing at least some light to pass through.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.