Integrated circuit package lid with a wetting film
US7633151B2 · kind B2 · utility
6Cited by
18References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2007 |
| Grant date | Dec 15, 2009 |
| Priority date | — |
| Expiry date | Jun 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Various integrated circuit packages, lids therefor and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing an integrated circuit package lid that has a surface adapted to face towards an integrated circuit, and forming a wetting film on the surface. The wetting film has at least one void where the surface of the lid is exposed. The void inhibits bonding so that a stress reduction site is produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.