Polymer, resist protective coating material, and patterning process
US7642034B2 · kind B2 · utility
15Cited by
3References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Jan 30, 2007 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | Jan 30, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0046
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polymer comprising repeat units having formula (1) wherein R1 and R2 are hydrogen or C1-C12 alkyl, or R1 and R2 may bond together to form a ring, and R30 is hydrogen or methyl is used to formulate a resist protective coating material. A protective coating formed therefrom on a resist film is water-insoluble, dissolvable in alkali aqueous solution or alkaline developer, and immiscible with the resist film so that the immersion lithography can be conducted in a satisfactory manner. During alkali development, development of the resist film and removal of the protective coating can be simultaneously achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.