Patent · US Active

Integrated circuit component with passivation layer

US7642641B2 · kind B2 · utility

11Cited by

11References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Joachim Mahler · Regensburg, DE
Ralf Otremba · Kaufbeuren, DE
Bernd Betz · Neutraubling, DE
Khalil Hosseini · Weihmichl, DE

Key dates

Filing date	May 31, 2007
Grant date	Jan 5, 2010
Priority date	—
Expiry date	Aug 2, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor component includes a semiconductor chip provided with a passivation layer that covers the topmost interconnect structure of the semiconductor chip whilst leaving contact areas free. The passivation layer is in direct adhesive contact with the plastic housing composition of the semiconductor component. The passivation layer includes a polymer with embedded mineral-ceramic nanoparticles.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.