Digital camera module with small sized image sensor chip package
US7643081B2 · kind B2 · utility
6Cited by
0References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2006 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | Sep 19, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A digital camera module (200) includes a lens holder (20), a lens module (30) received in the lens holder, and an image sensor chip package (40) mounted to the lens holder. The lens module includes a lens barrel (301) movably engaged in the lens holder and at least one lens (302) received in the lens barrel. The image sensor chip package includes a base (401), an image sensor chip (402) mounted on the base, a transparent cover (405), and an adhesive (50) positioning the transparent cover with respect to the image sensor chip. The adhesive and the transparent cover cooperatively seal the image sensor chip therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.