Method for producing a mask for the lithographic projection of a pattern onto a substrate
US7644389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2007 |
| Grant date | Jan 5, 2010 |
| Priority date | — |
| Expiry date | Jun 29, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F1/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A layout is decomposed into partial patterns. An intermediate mask is drawn for each of the partial patterns. The intermediate masks are used in a mask stepper or scanner progressively for projection again into a common pattern on a test mask. A line width distribution LB(x,y) is determined from the test mask or from a test wafer exposed using the mask, and is converted into a distribution of dose corrections. The transmission T(x,y) of the respective intermediate masks is adapted based upon the calculated dose correction. This can be achieved using additional optical elements which are assigned to the intermediate masks and have shading structure elements, or by laser-induced rear-side introduction of shading elements in the quartz substrate of the intermediate masks themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.