Bonding interface quality by cold cleaning and hot bonding
US7645682B2 · kind B2 · utility
6Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2007 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Nov 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02052
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to improvements in a method for molecularly bonding first and second substrates together by placing them in surface to surface contact. The improvement includes, prior to placing the substrates in contact, cleaning the surface of one or both of the substrates in a manner to provide a cleaned surface that is slightly roughened compared to a conventionally polished surface, and heating at least one or both of the substrates prior to placing the substrates in contact while retaining the heating at least until the substrates are in surface to surface contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.