Inventor · Crolles, FR

Daniel Delprat

24Patents
5h-index
34Co-inventors
69Inventor score

Filing activity: May 31, 2001 → Apr 18, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6563631B2 Tunable gain-clamped semiconductor optical amplifier Electricity 27 Expired
US7405136B2 Methods for manufacturing compound-material wafers and for recycling used donor substrates Electricity 15 Active
US6459158B1 Vertically-tolerant alignment using slanted wall pedestal Physics 7 Expired
US7645682B2 Bonding interface quality by cold cleaning and hot bonding Electricity 6 Active
US8580654B2 Method for molecular bonding of silicon and glass substrates Electricity 5 Active
US8357974B2 Semiconductor on glass substrate with stiffening layer and process of making the same Electricity 5 Active
US8790993B2 Method for molecular bonding of silicon and glass substrates Electricity 3 Active
US9716029B2 Method for transferring a layer of a semiconductor and substrate comprising a confinement structure Electricity 3 Active
US8962450B2 Method for manufacturing a semiconductor-on-insulator structure having low electrical losses Electricity 3 Active
US8349703B2 Method of bonding two substrates Electricity 2 Active
US7485545B2 Method of configuring a process to obtain a thin layer with a low density of holes Electricity 2 Active
US10826459B2 Heterostructure and method of fabrication Emerging Cross-Sectional Technologies 2 Active
US8658514B2 Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure Electricity 1 Active
US11637542B2 Heterostructure and method of fabrication Emerging Cross-Sectional Technologies 1 Active
US11373898B2 Method for manufacturing a semiconductor on insulator type structure by layer transfer Electricity 0 Active
US12101080B2 Heterostructure and method of fabrication Emerging Cross-Sectional Technologies 0 Active
US8946053B2 Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate Electricity 0 Active
US9293473B2 Method for manufacturing a semiconductor on insulator structure having low electrical losses Electricity 0 Active
US11595020B2 Heterostructure and method of fabrication Emerging Cross-Sectional Technologies 0 Active
US8518799B2 Process of making semiconductor on glass substrates with a stiffening layer Electricity 0 Active
US8772875B2 Semiconductor on glass substrate with stiffening layer Electricity 0 Active
US11205702B2 Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit Electricity 0 Active
US12362226B2 Method for forming a handling substrate for a composite structure intended for RF applications and handling substrate Electricity 0 Active
US7919391B2 Methods for preparing a bonding surface of a semiconductor wafer Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.