Digital camera module packaging method
US7646429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2006 |
| Grant date | Jan 12, 2010 |
| Priority date | — |
| Expiry date | Jan 10, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/55
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A digital camera module packaging method includes: first, providing a carrier (20) including a base (21) defining a chamber (214) and a lead frame (23). The lead frame has a plurality of conduction pieces (233) embedded in the base. One end of each conduction piece is exposed at one surface of the base, and another end of the conduction piece is exposed at another surface of the base. An image sensor chip (30) with a photosensitive area (301) and a plurality of chip pads (302) is then mounted in the chamber. A plurality of wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one exposed end of a corresponding conduction piece of the carrier. A holder (50) is then provided. The carrier is mounted to the holder. Finally, a lens module (70) is mounted on the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.