System and method of detecting IC die cracks
US7649200B1 · kind B1 · utility
19Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2005 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Jul 13, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A structure and method is utilized to detect cracks, fissures, fractures, or other dislocations in an IC die. A conductive line in a metal layer is provided about the periphery of the IC die. A break in the conductive line indicates that the IC die is cracked. A JTAG interface can be utilized to provide an indication of whether the die is cracked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.