Seth Prejean
6Patents
2h-index
11Co-inventors
44Inventor score
Filing activity: May 19, 2005 → Oct 11, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7649200B1 | System and method of detecting IC die cracks | Electricity | 19 | Active |
| US9437561B2 | Semiconductor chip with redundant thru-silicon-vias | Electricity | 9 | Active |
| US7795589B2 | Infrared sensor and method of calibrating the same | Physics | 1 | Active |
| US9627281B2 | Semiconductor chip with thermal interface tape | Electricity | 0 | Active |
| US12094853B2 | Semiconductor chip with redundant thru-silicon-vias | Electricity | 0 | Active |
| US11469212B2 | Semiconductor chip with redundant thru-silicon-vias | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.