Pad over active circuit system and method with frame support structure
US7649269B2 · kind B2 · utility
1Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2007 |
| Grant date | Jan 19, 2010 |
| Priority date | — |
| Expiry date | Jan 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit and method of fabricating the same are provided. Included are an active circuit, and a metal layer disposed, at least partially, above the active circuit. Further provided is a bond pad disposed, at least partially, above the metal layer. To prevent damage incurred during a bonding process, the aforementioned metal layer may define a frame with an outer periphery and an inner periphery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.