Ge short wavelength infrared imager
US7651880B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2006 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Dec 5, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/184
Abstract
A germanium (Ge) short wavelength infrared (SWIR) imager and associated fabrication process are provided. The imager comprises a silicon (Si) substrate with doped wells. An array of pin diodes is formed in a relaxed Ge-containing film overlying the Si substrate, each pin diode having a flip-chip interface. There is a Ge/Si interface, and a doped Ge-containing buffer interposed between the Ge-containing film and the Ge/Si interface. An array of Si CMOS readout circuits is bonded to the flip-chip interfaces. Each readout circuit has a zero volt diode bias interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.