Jer-Shen Maa
102Patents
21h-index
30Co-inventors
90Inventor score
Filing activity: Dec 9, 1982 → Mar 17, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7115945B2 | Strained silicon fin structure | Electricity | 321 | Expired |
| US7419844B2 | Real-time CMOS imager having stacked photodiodes fabricated on SOI wafer | Electricity | 263 | Active |
| US7800148B2 | CMOS active pixel sensor | Electricity | 218 | Active |
| US7045401B2 | Strained silicon finFET device | Electricity | 170 | Expired |
| US7598108B2 | Gallium nitride-on-silicon interface using multiple aluminum compound buffer layers | Electricity | 77 | Active |
| US6441417B1 | Single c-axis PGO thin film on ZrO2 for non-volatile memory applications and methods of making the same | Electricity | 77 | Expired |
| US6562703B1 | Molecular hydrogen implantation method for forming a relaxed silicon germanium layer with high germanium content | Emerging Cross-Sectional Technologies | 77 | Expired |
| US7323349B2 | Self-aligned cross point resistor memory array | Electricity | 58 | Active |
| US6048740A | Ferroelectric nonvolatile transistor and method of making same | Electricity | 58 | Expired |
| US6703293B2 | Implantation at elevated temperatures for amorphization re-crystallization of Si1-xGex films on silicon substrates | Emerging Cross-Sectional Technologies | 41 | Expired |
| US6583000B1 | Process integration of Si1-xGex CMOS with Si1-xGex relaxation after STI formation | Electricity | 40 | Expired |
| US5830775A | Raised silicided source/drain electrode formation with reduced substrate silicon consumption | Emerging Cross-Sectional Technologies | 35 | Expired |
| US6767802B1 | Methods of making relaxed silicon-germanium on insulator via layer transfer | Electricity | 34 | Expired |
| US4411734A | Etching of tantalum silicide/doped polysilicon structures | Electricity | 33 | Expired |
| US7008813B1 | Epitaxial growth of germanium photodetector for CMOS imagers | Emerging Cross-Sectional Technologies | 31 | Expired |
| US6992025B2 | Strained silicon on insulator from film transfer and relaxation by hydrogen implantation | Electricity | 27 | Expired |
| US7018882B2 | Method to form local “silicon-on-nothing” or “silicon-on-insulator” wafers with tensile-strained silicon | Electricity | 27 | Expired |
| US5814537A | Method of forming transistor electrodes from directionally deposited silicide | Emerging Cross-Sectional Technologies | 26 | Expired |
| US7906825B2 | Ge imager for short wavelength infrared | Electricity | 22 | Active |
| US6043164A | Method for transferring a multi-level photoresist pattern | Electricity | 22 | Expired |
| US6903384B2 | System and method for isolating silicon germanium dislocation regions in strained-silicon CMOS applications | Electricity | 22 | Expired |
| US7390725B2 | Strained silicon on insulator from film transfer and relaxation by hydrogen implantation | Electricity | 20 | Active |
| US7186611B2 | High-density germanium-on-insulator photodiode array | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6190963A | Composite iridium-metal-oxygen barrier structure with refractory metal companion barrier and method for same | Electricity | 19 | Expired |
| US7651880B2 | Ge short wavelength infrared imager | Electricity | 19 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.