Wafer lever fixture and method for packaging micro-electro-mechanical-system devices
US7651888B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2008 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Jul 16, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0127
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A fixture for packaging MEMS devices includes a base, a first material layer, an insulating layer and a second material layer. The base defines units, each including a notch. The first material layer is disposed on the base and the notches. The insulating layer is disposed on a part of the first material layer and exposes the other part of the first material layer located on the notches. The second material layer is disposed on the other part of the first material layer and formed with caps, whereby the caps are physically connected to the MEMS devices, and the MEMS devices are corresponding to the units of the base, wherein there is a first connecting force between the first and second material layers, there is a second connecting force between the caps and the MEMS devices, and the second connecting force is greater than the first connecting force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.