Electromagnetic shield formation for integrated circuit die package
US7651889B2 · kind B2 · utility
84Cited by
21References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2007 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Dec 20, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.