Semiconductor devices and methods of manufacture thereof
US7652336B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 6, 2007 |
| Grant date | Jan 26, 2010 |
| Priority date | — |
| Expiry date | Jan 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/038
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor devices and methods of manufacture thereof are disclosed. In a preferred embodiment, a method of manufacturing a semiconductor device includes providing a semiconductor wafer, forming at least one isolation structure within the semiconductor wafer, and forming at least one feature over the semiconductor wafer. A top portion of the at least one isolation structure is removed, and a liner is formed over the semiconductor wafer, the at least one feature, and the at least one isolation structure. A fill material is formed over the liner. The fill material and the liner are removed from over at least a portion of a top surface of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.