Apparatus for electroless deposition of metals onto semiconductor substrates
US7654221B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2005 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Mar 18, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/1632
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electroless deposition system and electroless deposition stations are provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate a surface of a substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate shuttle positioned to transfer substrates between the first and second processing stations. The electroless deposition station also includes various fluid delivery and substrate temperature controlling devices to perform a contamination free and uniform electroless deposition process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.