Patent · US Active

Method, device and system for bonding a semiconductor element

US7654434B2 · kind B2 · utility

0Cited by

9References

11Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Dirk Siepe · Dortmund, DE
Reinhold Bayerer · Warstein, DE
Andreas Lenniger · Erwitte, DE

Key dates

Filing date	Mar 20, 2006
Grant date	Feb 2, 2010
Priority date	—
Expiry date	Jan 30, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention relates to a method and also a device and a system for bonding a semiconductor element (4), in which various contact areas (8) of the semiconductor element (4) are successively connected to terminal areas (2, 3, 7) by means of bonding wire elements (6) and in which an electrical variable influenced by the semiconductor element (4) is acquired during the bonding operation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.