Electroprocessing profile control
US7655565B2 · kind B2 · utility
8Cited by
86References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2005 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Sep 13, 2026 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied tot he first electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.