Patent · US Active

Package for an electronic component and method for its production

US7656018B2 · kind B2 · utility

8Cited by

3References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Michael Bauer · Nittendorf, DE
Jens Pohl · San Luis Obispo, US

Key dates

Filing date	Jun 1, 2006
Grant date	Feb 2, 2010
Priority date	—
Expiry date	Jan 21, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.