Stackable semiconductor package having metal pin within through hole of package
US7656031B2 · kind B2 · utility
12Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2007 |
| Grant date | Feb 2, 2010 |
| Priority date | — |
| Expiry date | Jul 6, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a stackable semiconductor having an interconnect board for providing electrical interconnections, the package includes a plurality of solders disposing onto the interconnect board; and a conducting metal pin passing through each solder and the interconnect board, the metal pins having at least one end disposes on the semiconductor package, wherein when a plurality of the stackable semiconductor packages are stacked together, the exposed end of the corresponding conducting pins are bonded together. A method of manufacturing the same is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.