Patent · US Active

Integrated circuit with improved component interconnections

US7656037B2 · kind B2 · utility

2Cited by

7References

19Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Martina Hommel · Munich, DE
Heinrich Koerner · Bruckmühl, DE
Markus Schwerd · Holzkirchen, DE
Martin Seck · Birkenfeld, DE

Key dates

Filing date	Sep 21, 2006
Grant date	Feb 2, 2010
Priority date	—
Expiry date	Jun 18, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit arrangement is disclosed. In one embodiment, the integrated circuit arrangement includes at least three conductive structures levels and elongated interconnects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.